Reliability and Modeling of Power Electronics Components - RMPEC 2025

Short description

Power semiconductor devices and passive elements are still under development, and their manufacturers are more and more improving production technologies. Therefore, components available on the market are able to operate at increasingly higher voltages, currents and frequencies. The effective use of these elements in power electronics requires proper tools for computer analysis of electronic and power electronic systems. Moreover, it is also important to predict the lifetime of these components operating under conditions of continuous operation and during thermal stresses.

This special session’s objective is to include papers presenting the latest achievements in the field of technology for manufacturing power semiconductor devices and passive elements. It aims to feature work on modeling and measuring the properties of these elements alone or as a part of the system.  Additionally, it seeks to showcase the results of reliability tests and introduce new measurement procedures.

List of topics

TBA

Co-chairs

Krzysztof Górecki
email: k.gorecki@we.umg.edu.pl
Gdynia Maritime University, Poland

Jacek Rąbkowski
email: jacek.rabkowski@pw.edu.pl
Warsaw University of Technology, Poland

Lorenzo Codecasa
email: lorenzo.codecasa@polimi.it
Politecnico di Milano, Italy

Program Committee

TBA